MicroElectronics

SELEX Sensors & Airborne Systems (S&AS) UK Centre of Excellence (COE) for  MicroElectronic Manufacture is located at our Edinburgh site and provides both production and development manufacturing services for advanced microwave and optical hybrid components for military applications.
 
Technology Experts from the field of Space, Semiconductors, Automotive and Opto-electronics fields combine to provide innovative solutions to the technology demands of today and of the future. Situated in a 13,000 sq feet Class 1000 clean-room that has been maintained through high levels of investment in both infrastructure and state of the art automation, this COE has stayed at the forefront of MicroElectronic technology.
 
Key facts:

• Established in Edinburgh 1964.
• Thick Film capability introduced in 1981.
• In 1988 we were the first UK Company to achieve CECC approval in hybrid microcircuits.
• We were the first UK company to develop a successful Aluminium Nitride substrate capability for use in military products.
• We specialise  in microwave / optical packaging technology using advanced thick film techniques.
• Major investment in equipment specifically designed for precision, automated microwave & optical module manufacture.
• Use of Design for Manufacture Methodology in packaging design.
• Six Sigma process monitors on all critical operations.

 
We lead Europe in design and functionality with our X-Band Transmit/Receive modules for Active E-Scan Radars.  We have formed strategic partnerships with commercial manufacturers to further reduce the cost and take advantage of volume manufacturing capability.
 
The advancement in sub micron technology has led to Optical, RF, Power, Analogue and Digital integration, into a single Multi-Chip Module. The MicroElectronics Group leads the field in this capability. Next generation Radar and Countermeasure systems will rely heavily on advanced packaging techniques, the ability to enhance functionality whilst reducing weight and real estate is paramount.
 
Core Services include:

• Robotic assembly to sub micron accuracy (Active Laser Modulator Alignment)
• Optical Module design and manufacture
• Advanced Thick and Thin film capability
• Microwave Module Manufacture (specialising in X-Band and Broad Band)
• Mixed signal multi - chip module manufacture
• Fully Automated (Pattern recognition) Assembly Capability  (5.85 Sigma -April 2006 Figure)
• DFM re-engineering services for MW/Optical Modules.